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Research Article

Study on radar electronic module cooling by using diamond/copper composites

Jinwang Li ,
Tianshu Cong ,
Shugang Dai
Volume 3, Issue 1 (2023)
DOI: 10.1080/26941112.2023.2273320

Keywords

Diamond/copper; composite; thermal conductivity; cooling

References

  • Ye W, Wei Q, Zhang L, et al. Macroporous diamond foam: a novel design of 3D interconnected heat conduction network for thermal management[J]. Materials & Design. 2018;156:1–9.  [Crossref] [Web of Science ®], [Google Scholar]
  • Lu W, Li J, Miao J, et al. Application of high-thermal-conductivity diamond for space phased array antenna[J]. Functional Diamond. 2021;1(1):189–196.  [Taylor & Francis Online], [Google Scholar]
  • Deng J, Zhang H, Fan T, et al. Recent progress on interface and thermal conduction models of diamond/copper composites used as electronic packaging material[J]. Mater Reports. 2016;30(3):19–28. (in Chinese).  [Google Scholar]
  • Tao J, Zhu X, Tian W, et al. Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method[J]. Trans Nonferrous Met Soc China. 2014;24(10):3210–3214.  [Crossref] [Web of Science ®], [Google Scholar]
  • Mousavi SE, Naghshehkesh N, Amirnejad M, et al. Corrosion performance and tribological behavior of diamond-like carbon based coating applied on NiAlbronze alloy[J]. Trans Nonferrous Met Soc China. 2021;31(2):499–511.  [Crossref] [Web of Science ®], [Google Scholar]
  • Zhao Y, Liu K, Lu D, et al. Research status and prospect of CD/Cu composite for electronic packaging material[J]. Heat Treatment Technol Equipment. 2013;34:31–36. (In Chinese)  [Google Scholar]
  • Dai S, Li J, Dong C. Research progress on preparation ­methods of high thermal conductivity diamond/copper composites[J]. Fine Chem. 2019;36:1995–2008. (In Chinese)  [Google Scholar]
  • Wei C, Xu X, Wei B, et al. Effect of diamond surface treatment on microstructure and thermal conductivity of diamond/W-30Cu composites prepared by microwave sintering[J]. Diamond Relat Mater. 2020;104:107760.  [Crossref] [Web of Science ®], [Google Scholar]
  • Liu X, Sun F, Wang L, et al. The role of Cr interlayer in determining interfacial thermal conductance between Cu and diamond[J]. Appl Surf Sci. 2020;515:146046.  [Crossref] [Web of Science ®], [Google Scholar]
  • Dai S, Li J, Wang C. Preparation and thermal conductivity of tungsten coated diamond/copper composites[J]. Trans Nonferrous Met Soc China. 2022;32(9):2979–2992.  [Crossref] [Web of Science ®], [Google Scholar]
  • Dai S, Li J, Lu N. Research progress of diamond/copper composites with high thermal conductivity. Diamond Relat Mater. 2020;108:107993.  [Crossref] [Web of Science ®], [Google Scholar]
  • Zhang L, Qian J, Kong X, et al. Research on performance of diamond/copper composite substrate based on bare die packaging[J]. Electro-Mech Engin. 2011;27(06):28–30.  [Google Scholar]
  • Zhang L, Qian J, Niu T, et al. Application research of diamond/copper in solid-state microwave power devices[J]. Electro-Mech Engin. 2017;33(6):55–58.  [Google Scholar]
  • Guo H. Research on diamond/Cu composites for aerospace application under cold temperature[D]. University of Science and Technology Beijing; 2015.  [Google Scholar]
  • Zhang X, Guo H, Yin F, et al. Improving method of interface bonding state in diamond/Cu composite material[J]. Rare Met. 2013;37(2):335–340.  [Google Scholar]
  • Fan Y, Guo H, Xu J, et al. Pressure infiltrated Cu/diamond composites for LED applications[J]. Rare Met. 2011;30(2):206–210.  [Crossref] [Web of Science ®], [Google Scholar]
  • Ji X, Lai J. Application of ultrahigh thermal conductivity diamond copper composite materials on the GaN device[J]. Adv Packaging Technol. 2017;42(4):310–314.  [Google Scholar]
  • Li J. Capillary pumping performance of porous structure and its preparation and optimization for loop heat pipe[D]. Shandong University, 2011. (In Chinese)  [Google Scholar]
  • Muzychka Y, Culham R, Yovanovich M. Thermal spreading resistances in rectangular flux channels: part I geometric equivalences[C]. 36th AIAA Thermophysics Conference, 2003: 1–10.  [Crossref], [Google Scholar]
  • Lee S, Song S, Au V, et al. Constriction/spreading resistance model for electronics packaging[J]. ASME/JSME Thermal Engineering Conference, 1995: 199–206.  [Google Scholar]
  • Song S, Lee S, Au V. Closed-form equation for thermal constriction/spreading resistances with variable resistance boundary condition[C] Proceedings of the International electronics packaging conference, 1994: p. 111–121.  [Google Scholar]
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