Diamond has many excellent physicochemical properties including ultrahigh hardness

wide bandgap

outstanding thermal conductivity

and high electron mobility

which has emerged as a critical material for high-power electronics

quantum technologies

and micro/nano-electromechanical systems (MEMS/NEMS). Single crystalline diamond tends to have better performance than polycrystalline diamond in some fields including thermal management

optics and quantum information. However

its extreme hardness and chemical inertness pose significant challenges for scalable microfabrication and require specialized techniques beyond conventional silicon-based processes. This paper systematically summarizes the latest progress in single crystalline diamond (SCD) MEMS manufacturing

including the diamond growth achieved through high pressure and high temperature (HPHT) or chemical vapor deposition (CVD)

two-dimensional (2D) nanostructures achieved through inductively coupled plasma (ICP) etching and focused ion beam (FIB) milling and three-dimensional (3D) structures achieved through ion implant-assisted exfoliation (IAL)

diamond on insulator (DOI)

and angled etching strategies. We focused on introducing the applications of SCD in thermal management

photonic device

quantum systems

and heterojunctions. However

there are still some challenges

such as high fabrication costs

interfacial thermal resistance in hetero-integrated devices

and limitations in n-type doping efficiency. Emerging approaches like deep elastic strain engineering (DESE) can offer novel pathways to regulate SCD’s electronic and quantum properties. In the future

interdisciplinary combination in materials science

nanofabrication

and quantum engineering are critical to for next-generation electronics

quantum information

and MEMS technologies of diamond.