Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets

Masafumi Inaba; Seiya Seike; Yingchen Chen; Soichiro Ichiki; Yoshihiko Kubota; Shinya Ohmagari; Michihiko Nakano; Junya Suehiro

doi:10.1080/26941112.2024.2423643

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Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets

Research Article | Updated：2025-01-22

- Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets
- Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets
- Functional Diamond 2024年4卷第1期
- Affiliations：
  
  1. a Faculty of Information Science and Electrical Engineering Kyushu University
  2. b Graduate School of Information Science and Electrical Engineering Kyushu University
  3. c Sensing System Research Center (SSRC) National Institute of Advanced Industrial Science and Technology (AIST)
- Author bio：
- Funds：
- DOI：10.1080/26941112.2024.2423643
  中图分类号：
- 网络首发：2024-11-05，
  
  纸质出版：2024
- Accepted：
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Masafumi Inaba, Seiya Seike, Yingchen Chen, 等. Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets[J]. Functional Diamond, 2024,4(1).

Masafumi Inaba, Seiya Seike, Yingchen Chen, et al. Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets[J]. Functional Diamond2024, 4(1).
Masafumi Inaba, Seiya Seike, Yingchen Chen, 等. Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets[J]. Functional Diamond, 2024,4(1). DOI： 10.1080/26941112.2024.2423643.

Masafumi Inaba, Seiya Seike, Yingchen Chen, et al. Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets[J]. Functional Diamond2024, 4(1). DOI： 10.1080/26941112.2024.2423643.

摘要

Abstract

Heat conduction sheets

which are composed of a thermally conductive filler and a base elastomer matrix

are important for dissipating heat from devices to a heat sink. Alignment of the heat-conducting two-dimensional filler particles enhances the thermal conductivity of the heat conduction sheet. In this study

we prepared polycrystalline diamond (PCD) flakes and then electrically aligned the PCD flakes in the through-plane direction of heat conduction sheet samples. The PCD flakes were fabricated by pulverizing a synthesized PCD thin layer. The typical size of the PCD flakes was ∼1 μm in thickness and ∼35 μm in diameter. The PCD flakes were electrically aligned in a polydimethylsiloxane (PDMS) matrix by applying alternating high voltage with parallel-plate electrodes. The heat conduction sheet containing 20 wt% aligned PCD flakes in the matrix exhibited high through-plane thermal conductivity of 0.47 W m

−1

while that of the heat conduction sheet with aligned granular diamond filler particles was 0.37 W m

−1

. The high thermal conductivity comes from the formation of

a large contact area between the filler particles and flake network by electrical alignment in the heat conduction sheet.

关键词

Keywords

references

Moore AL, Shi L. Emerging challenges and materials for thermal management of electronics. Mater Today. 2014;17(4):163–174. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Yu H, Li L, Zhang Y. Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications. Scr Mater. 2012;66(11):931–934. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zhan H, Chen YW, Shi QQ, et al. Highly aligned and densified carbon nanotube films with superior thermal conductivity and mechanical strength. Carbon NY. 2022;186:205–214. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Prasher R. Thermal interface materials: historical perspective, status, and future directions. Proc IEEE. 2006;94(8):1571–1586. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ma J, Shang T, Ren L, et al. Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material. Chem Eng J. 2020;380:122550. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Chen H, Ginzburg VV, Yang J, et al. Thermal conductivity of polymer-based composites: fundamentals and applications. Prog Polym Sci. 2016;59:41–85. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Burger N, Laachachi A, Ferriol M, et al. Review of thermal conductivity in composites: mechanisms, parameters and theory. Prog Polym Sci. 2016;61(open in a new window):1–28. 10.1016/j.progpolymsci.2016.05.001 (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Han Z, Fina A. Thermal conductivity of carbon nanotubes and their polymer nanocomposites: a review. Prog Polym Sci. 2011;36(7):914–944. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Wu X, Shi S, Tang B, et al. Achieving highly thermal conductivity of polymer composites by adding hybrid silver–carbon fiber fillers. Compos Commun. 2022;31:101129. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ouyang Y, Bai L, Tian H, et al. Recent progress of thermal conductive ploymer composites: al2O3 fillers, properties and applications. Compos A Appl Sci Manuf. 2022;152:106685. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ouyang Y, Li X, Ding F, et al. Simultaneously enhance thermal conductive property and mechanical properties of silicon rubber composites by introducing ultrafine Al2O3 nanospheres prepared via thermal plasma. Compos Sci Technol. 2020;190:108019. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ozen M, Demircan G, Kisa M, et al. Thermal properties of surface-modified nano-Al2O3/Kevlar fiber/epoxy composites. Mater Chem Phys. 2022;278:125689. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Lee GW, Park M, Kim J, et al. Enhanced thermal conductivity of polymer composites filled with hybrid filler. Compos A Appl Sci Manuf. 2006;37(5):727–734. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zou D, Huang X, Zhu Y, et al. Boron nitride nanosheets endow the traditional dielectric polymer composites with advanced thermal management capability. Compos Sci Technol. 2019;177:88–95. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Hu Q, Bai X, Zhang C, et al. Oriented BN/Silicone rubber composite thermal interface materials with high out-of-plane thermal conductivity and flexibility. Compos A Appl Sci Manuf. 2022;152:106681. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zahhaf O, D’Ambrogio G, Le MQ, et al. Dielectrophoretic alignment of Al2O3/PDMS composites: enhancement of thermal and dielectric properties through structural sedimentation analysis. Mater Des. 2021;211:110134. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Li L, Qin Y, Wang H, et al. Improving thermal conductivity of poly(vinyl alcohol) composites by using functionalized nanodiamond. Compos Commun. 2021;23:100596. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Wu W, Ren T, Liu X, et al. Creating thermal conductive pathways in polymer matrix by directional assembly of synergistic fillers assisted by electric fields. Compos Commun. 2022;35:101309. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Huang X, Sun B, Zhu Y, et al. High-k polymer nanocomposites with 1D filler for dielectric and energy storage applications. Prog Mater Sci. 2019;100:187–225. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Sun M, Dai B, Liu K, et al. Enhancement in thermal conductivity of polymer composites using aligned diamonds coated with superparamagnetic magnetite. Compos Sci Technol. 2018;164:129–135. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Lin Z, Liu Y, Raghavan S, et al. Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation. ACS Appl Mater Interfaces. 2013;5(15):7633–7640. (Open in a new window)PubMed (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Yu C, Gong W, Tian W, et al. Hot-pressing induced alignment of boron nitride in polyurethane for composite films with thermal conductivity over 50 Wm − 1 K − 1. Compos Sci Technol. 2018;160:199–207. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zhang G, Xue S, Chen F, et al. An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity. Compos Sci Technol. 2023;231(open in a new window):109784. 10.1016/j.compscitech.2022.109784 (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Xu S, Zhang J. Vertically aligned graphene for thermal interface materials. Small Struct. 2020;1(open in a new window):2000034. 10.1002/sstr.202000034 (Open in a new window)Google Scholar

Xu S, Wang S, Chen Z, et al. Electric‐field‐assisted growth of vertical graphene arrays and the application in thermal interface materials. Adv Funct Mater. 2020;30(open in a new window):2003302. 10.1002/adfm.202003302 (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zhang G, Liu H, Xiao Y, et al. Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials. Funct Diamond. 2022;2(1):263–270. (Open in a new window)Google Scholar

Yu H, Feng Y, Chen C, et al. Thermally conductive, self-healing, and elastic Polyimide@Vertically aligned carbon nanotubes composite as smart thermal interface material. Carbon NY. 2021;179:348–357. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Slack GA. Nonmetallic crystals with high thermal conductivity. J Phys Chem Solids. 1973;34(2):321–335. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Simon RB, Anaya J, Faili F, et al. Effect of grain size of polycrystalline diamond on its heat spreading properties. Appl Phys Express. 2016;9(6):061302. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Inaba M, Chen Y, Seike S, et al. Effect of the gravitational force on electrical alignment of diamond filler particles in polydimethylsiloxane-based heat-conduction sheets. Diam. Relat. Mater. 2024;146:111246. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Chen J, Huang X, Sun B, et al. Vertically aligned and interconnected boron nitride nanosheets for advanced flexible nanocomposite thermal interface materials. ACS Appl Mater Interfaces. 2017;9(36):30909–30917. (Open in a new window)PubMed (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Shi Z, Radwan M, Kirihara S, et al. Enhanced thermal conductivity of polymer composites filled with three-dimensional brushlike AlN nanowhiskers. Appl Phys Lett. 2009;95(open in a new window):224104. 10.1063/1.3271028 (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Chen YM, Ting JM. Ultra high thermal conductivity polymer composites. Carbon NY. 2002;40(3):359–362. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Hasegawa R, Inoue K, Muneoka H, et al. Electric-field-assisted fabrication of metal-class thermal-conductive and elastomer-class-flexible composites comprising plasma-surface-modified hexagonal boron nitride and polyrotaxane. Compos A Appl Sci Manuf. 2024;184:108197. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ohmagari S, Yamada H, Umezawa H, et al. Characterization of free-standing single-crystal diamond prepared by hot-filament chemical vapor deposition. Diam Relat Mater. 2014;48:19–23. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ohmagari S, Srimongkon K, Yamada H, et al. Low resistivity p + diamond (100) films fabricated by hot-filament chemical vapor deposition. Diam Relat Mater. 2015;58:110–114. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Ohmagari S. Single-crystal diamond growth by hot-filament CVD: a recent advances for doping, growth rate and defect controls. Funct Diamond. 2023;3(1):2259941. (Open in a new window)Google Scholar

ASTM. D547-01, standard test method for thermal transmission properties of thin thermally conductive solid electrical insulation materials. West Conshohocken (CT): ASTM; 2001. (Open in a new window)Google Scholar

Ukraintsev E, Kromka A, Janssen W, et al. Electron emission from H-terminated diamond enhanced by polypyrrole grafting. Carbon NY. 2021;176:642–649. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Takeuchi D, Kato H, Ri GS, et al. Direct observation of negative electron affinity in hydrogen-terminated diamond surfaces. Appl Phys Lett. 2005;86(open in a new window):152103. 10.1016/j.carbon.2020.12.043 (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Hu J, Huang Y, Yao Y, et al. Polymer composite with improved thermal conductivity by constructing a hierarchically ordered three-dimensional interconnected network of BN. ACS Appl Mater Interfaces. 2017;9(15):13544–13553. (Open in a new window)PubMed (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zhang F, Feng Y, Feng W. Three-dimensional interconnected networks for thermally conductive polymer composites: design, preparation, properties, and mechanisms. Mater Sci Eng R Rep. 2020;142:100580. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Hill RF, Supancic PH. Thermal conductivity of platelet-filled polymer composites. J Am Ceram Soc. 2002;85(4):851–857. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

Zhou S, Xu J, Yang QH, et al. Experiments and modeling of thermal conductivity of flake graphite/polymer composites affected by adding carbon-based nano-fillers. Carbon NY. 2013;57:452–459. (Open in a new window)Web of Science ®(Open in a new window)Google Scholar

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