Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials

Guorong Zhang; Huiqiang Liu; Yangxin Xiao; Bing Wang; Jian Wang; Wen Zhang; Ying Xiong

doi:10.1080/26941112.2023.2169080

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Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials

Research Article | Updated：2023-01-27

- Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials
- Functional Diamond Vol. 2, Issue 1, Pages: 263-270(2022)
- Affiliations：
  
  1. a School of Materials & Chemistry Southwest University of Science & Technology
  2. a School of Materials & Chemistry Southwest University of Science & Technology Mianyang P.R. China
  3. b State Key Laboratory for Environment-Friendly Energy Materials Southwest University of Science & Technology
- Author bio：
- Funds：
- DOI：10.1080/26941112.2023.2169080
  CLC：
- Online First：27 January 2023，
  
  Published：2022
- Accepted：
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Guorong Zhang, Huiqiang Liu, Yangxin Xiao, et al. Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials[J]. Functional Diamond2022, 2(1): 263-270.
DOI：

Guorong Zhang, Huiqiang Liu, Yangxin Xiao, et al. Orientated growth the 3D diamond/graphene hybrid arrays and the application in thermal interface materials[J]. Functional Diamond2022, 2(1): 263-270. DOI： 10.1080/26941112.2023.2169080.

摘要

Abstract

Diamond and graphene are considered to be one of the most promising thermal interface materials (TIMs) for electronic devices benefited from their highest thermal conductivity in the natural world. However

orientated fabrication of high thermal conductivity diamond and graphene hybrid arrays with three dimensions (3 D) thermal conductive networks are still problematic. Here

we used a unique one-step microwave plasma chemical vapor deposition

n-butylamine

as the liquid source to prepare a novel high thermal conductivity 3 D vertical diamond/graphene (VDG) hybrid arrays films. The orientated 3 D thermal conduction path of the VDG is regulated by the growth temperature

and the through-plane thermal conductivity value of the VDG

700

films up to 97 W m

−1

. In the actual TIM performance measurement

the system cooling efficiency with our VDG as TIM is higher than the state-of-the-art commercial TIM

demonstrating the superior ability to solve the inter-facial heat transfer issues in electronic systems.

关键词

Keywords

references

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